Qual Flat Package (QFP), LQFP (Low profile) & TQFP (Thin)

• A surface mount integrated circuit package with gull wing leads extending from each of the 4 sides
• Available lead count from 32L to 256L, include exposed pad for thermal enhancement

Dual Flat No Leads (DFN) and Qual Flat No Leads (QFN) packages

• A very small square or rectangular surface mount plastic package with no leads
• DFN standard body size available from 2 x 1mm to 10 x 10mm with lead count from 2L to 16L
• QFN standard body size available from 1 x 1mm to 10 x 10mm with lead count from 8L to 72L

Small Outline Integrated Circuit (SOIC) and Thin Shrink Small Outline Package (TSSOP)

• A leaded rectangular plastic surface mount integrated circuit with 8 or more gull wings leads, bent outwards at the tip
• The leads are on two length sides of the package on either a Narrow Body (NB) or Wide Body (WB)
• SOIC & TSSOP available lead count from 8L to 64L, include exposed pad for thermal enhancement

Small Outline Transistor (SOT) plastic package & Small Outline Diode (SOD) plastic package

• A leaded plastic surface mount transistor component with 3 or more gull wing leads, bend outwards at the tip
• Commonly used as protection devices transient voltage suppressors, voltage regulators and high speed switching devices

Power Device

• Multiple-dies in single package
• Application in diode bridge for main rectification
• Rectifiers in switch mode power supplies (SMPS)
• Free wheeling diode in low voltage converters