PCB/PCBA

HDI PCB

  • Suitable for BGA with smaller ball pitch and higher I/O counts
  • Fine line, micro via and registration technologies capable of 0.3 mm ball pitch, Increase routing density in complicated design
  • Thin board capabilities, copper filled via and excellent mounting stability and reliability
  • Lower Dk / Df material enables better signal transmission performance.
  • Low CTE & High Tg material fulfills high reliability demand
  • Qualified material and surface treatment for Lead-free process

ELIC PCB

  • Every layer via structure to achieve miniature design (10L min. 0.45mm thickness)
  • Copper filled via provides better reliability
  • Superior electrical characteristics

Multi-layer PCB

  • From 2 to 32 layers
  • Supports fine line & narrow pitch CSP mounting
  • Good impedance control
  • Green material and process capabilities