IC Carrier/Substrate
![](https://i0.wp.com/www.itronics-sg.com/wp-content/uploads/2021/05/IC-S-MM2.jpg?resize=500%2C400&ssl=1)
Memory Module
- Overall substrate thickness down to 0.09mm
- Critical for substrate flatness
- Green/Black solder mask on each side are available
- Soft Gold and Hard Gold on each side
![](https://i0.wp.com/www.itronics-sg.com/wp-content/uploads/2021/05/IC-S-FCBGA.jpg?resize=500%2C400&ssl=1)
FCBGA
- Package Size: 8mm x 8mm to 110mm x 110mm
- Line & Space 8/8um (SAP); 25/25um (mSAP)
- Bump Pitch down to 90um (SAP); 260um (mSAP)
- Impedance control for critical signal traces
- Structure range from 1/2/1 to 10/n/10
- Automotive grade
![](https://i0.wp.com/www.itronics-sg.com/wp-content/uploads/2021/05/IC-S-FCCSP.jpg?resize=500%2C400&ssl=1)
FCCSP
- Package Size: 3 x 3mm up to 15 x 15mm.
- Line & Space 10/15um (SAP); 25/25um (mSAP)
- Bump Pitch down to 130um (SAP); 300um (mSAP)
- Impedance control for critical signal traces
- Structure range from 2 layers to 16 layers.
- For products demanding high density and reliability
- For small package size with high electric performance product
![](https://i0.wp.com/www.itronics-sg.com/wp-content/uploads/2021/05/IC-S-CSP.jpg?resize=500%2C400&ssl=1)
CSP
- Package Size: 3 x 3mm up to 19 x 19mm
- Thickness: 0.10mm – 0.36mm
- Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm
- Line & Space down to 10/15um (SAP); 25/25um (mSAP)
- RoHS compliance materials
- Layer count from 2 layer up to HDI 6 layers
- Structure: single die, multiple die, POP, Embedded Active Die
- Designed for strict reliability test including Drop Test