IC Carrier/Substrate

Memory Module

  • Overall substrate thickness down to 0.09mm
  • Critical for substrate flatness
  • Green/Black solder mask on each side are available
  • Soft Gold and Hard Gold on each side

FCBGA

  • Package Size: 8mm x 8mm to 110mm x 110mm
  • Line & Space 8/8um (SAP); 25/25um (mSAP)
  • Bump Pitch down to 90um (SAP); 260um (mSAP)
  • Impedance control for critical signal traces
  • Structure range from 1/2/1 to 10/n/10
  • Automotive grade

FCCSP

  • Package Size: 3 x 3mm up to 15 x 15mm.
  • Line & Space 10/15um (SAP); 25/25um (mSAP)
  • Bump Pitch down to 130um (SAP); 300um (mSAP)
  • Impedance control for critical signal traces
  • Structure range from 2 layers to 16 layers.
  • For products demanding high density and reliability
  • For small package size with high electric performance product

CSP

  • Package Size: 3 x 3mm up to 19 x 19mm
  • Thickness: 0.10mm – 0.36mm
  • Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm
  • Line & Space down to 10/15um (SAP); 25/25um (mSAP)
  • RoHS compliance materials
  • Layer count from 2 layer up to HDI 6 layers
  • Structure: single die, multiple die, POP, Embedded Active Die
  • Designed for strict reliability test including Drop Test