Packaging Design & Services

Design & Layout

  • A team of 20+ years experienced professional dedicated in PCB/FPC and custom BEOL Package System design to provide turnkey solutions for customers.
  • Offers SI/PI and Package System 3D mechanical modeling for Package System design.
  • Customer-centric approach to quickly and efficiently deliver quality designs.
  • Continuous investment in state-of-art solutions as enablers to meet demands of today’s leading edge technology.
  • Design utilizes Optimal DFM methodologies to achieve short time to market.

Design Platforms

  • Cadence
  • Mentor Graphics
  • Altium
  • Footprintku
  • Valor
  • PADS

SI/PI Modeling

  • Impedance optimization
  • Minimize return loss
  • Insertion loss reduction
  • Cross talk reduction
  • Power I/R drop characterization

SI/PI Measurement

  • Using Agilent Joint Laboratory (System Measurement)
  • Simulation vs Measurement
  • Characterization & Validation